Title :
The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate
Author :
Lin, Kwang-Lung ; Chiu, Ying-Ta
fDate :
May 31 2005-June 3 2005
Keywords :
Aging; Bonding; Environmentally friendly manufacturing techniques; Gold; Lead; Probes; Scanning electron microscopy; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441344
