مرکز منطقه ای اطلاع رساني علوم و فناوري - Application of Gold-Tin Solder Paste for Fine Parts and Devices

DocumentCode :

3347405

Title :

Application of Gold-Tin Solder Paste for Fine Parts and Devices

Author :

Ishikawa, Masayuki ; Sasaki, Hayato ; Ogawa, Satoko ; Kohinata, Masayoshi ; Mishima, Akifumi ; Yoshida, Hideaki

fYear :

2005

fDate :

May 31 2005-June 3 2005

Firstpage :

701

Lastpage :

709

Keywords :

Assembly; Costs; Gold; Lead; Packaging; Printing; Production; Sealing materials; Thermal conductivity; Tin;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location :

Lake Buena Vista, FL

ISSN :

0569-5503

Print_ISBN :

0-7803-8907-7

Type :

conf

DOI :

10.1109/ECTC.2005.1441346

Filename :

1441346

Link To Document :