DocumentCode :
3347415
Title :
Development of Flux-Free Reflow Soldering Process Using Hydrogen Radicals
Author :
Suenaga, Makoto ; Nakamori, Takashi ; Hirakawa, Daisuke ; Ohno, Yasuhide ; Hagihara, Taizo ; Kagami, Johji ; Takeuchi, Tatsuya
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
710
Lastpage :
715
Keywords :
Bonding; Chip scale packaging; Cleaning; Environmentally friendly manufacturing techniques; Flip chip; Gold; Hydrogen; Reflow soldering; Substrates; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441347
Filename :
1441347
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347415
