DocumentCode
3347466
Title
Co-Modeling and Co-Simulation of Package and On-Chip Decoupling Capacitor for Resonant Free Power/Ground Network Design
Author
Park, Hyunjeong ; Kim, Hyungsoo ; Kam, Dong Gun ; Kim, Joungho
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
727
Lastpage
731
Keywords
CMOS technology; Capacitors; Distributed parameter circuits; Inductance; Network-on-a-chip; Packaging; Power transmission lines; Resonance; Semiconductor device modeling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441350
Filename
1441350
Link To Document