DocumentCode :
3347466
Title :
Co-Modeling and Co-Simulation of Package and On-Chip Decoupling Capacitor for Resonant Free Power/Ground Network Design
Author :
Park, Hyunjeong ; Kim, Hyungsoo ; Kam, Dong Gun ; Kim, Joungho
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
727
Lastpage :
731
Keywords :
CMOS technology; Capacitors; Distributed parameter circuits; Inductance; Network-on-a-chip; Packaging; Power transmission lines; Resonance; Semiconductor device modeling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441350
Filename :
1441350
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347466
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