DocumentCode
3347529
Title
Power delivery validation of processor front side bus
Author
Suryakumar, Mahadevan ; He, Jiangqi
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
2005
fDate
31 May-3 June 2005
Firstpage
746
Abstract
With lower I/O operating voltage and decreasing noise margin targets, it is imperative that the amount of noise generated on the voltage rails is kept within tight tolerances for high speed signaling. For this a good understanding of the behavioral model of the package and on-die passives is required in addition to the on-die transients generated on the power supply network when I/O´s toggle. One of the major challenges is to accurately measure this dynamic power fluctuation (di/dt) for various I/O bit pattern excitation to understand the effectiveness of decoupling capacitors in the power distribution network. This paper discusses the power delivery validation methodology of the processor front side bus (FSB) that allows the user to input a stream of data into the I/O´s to measure the power supply noise and the resulting dynamic power fluctuation. A detailed three dimensional model of the package, motherboard was then created and simulated using Speed2K/PowerSI by Sigrity Corporation to correlate with measured results.
Keywords
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; power capacitors; power supply circuits; power system transients; I/O operating voltage; decoupling capacitor; dynamic power fluctuation; front side bus; noise margin target; on-die transient; power delivery; power distribution network; power supply network; Fluctuations; Noise generators; Packaging; Power generation; Power measurement; Power supplies; Power system dynamics; Rails; Signal generators; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441353
Filename
1441353
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