DocumentCode :
3347749
Title :
Ultra-High-Speed Signal Propagation of High-Density Wiring Interposer for 3D Packaging
Author :
Kikuchi, Katsuya ; Nakagawa, Hiroshi ; Tokoro, Kazuhiko ; Aoyagi, Masahiro ; Segawa, Shigemasa
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
809
Lastpage :
813
Keywords :
Curing; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Large scale integration; Packaging; Polyimides; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441365
Filename :
1441365
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347749
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