Enhancing fine pitch, high I/O devices with copper ball bonding

The graphic processing unit (GPU) represents the leading edge in assembly technology, eclipsing the central processing unit (CPU) as the most challenging semiconductor device. This paper will explore ways in which GPU´s are advancing the state-of-the-art in assembly with their lowest cost manufacturing requirements, high number of interconnects (now approaching 1000 interconnects/device) and demanding electrical requirements. The use of copper ball bonding in ultra-fine pitch applications such as GPUs is a new and challenging development.