Title :
Nano-Composite Lead-Free Interconnect and Reliability
Author :
Doraiswami, Ravi ; Tummala, Rao
fDate :
May 31 2005-June 3 2005
Keywords :
Assembly; Environmentally friendly manufacturing techniques; Fabrication; Flip chip; Lead; Magnetic properties; Mechanical factors; Nanoparticles; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441375
