DocumentCode :
3348141
Title :
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
Author :
Lal, Anand ; Bradley, Edwin ; Sharda, Jignesh
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
945
Lastpage :
953
Keywords :
Assembly; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Soldering; Temperature sensors; Testing; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441386
Filename :
1441386
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3348141
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