DocumentCode :
3348664
Title :
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
Author :
Aggarwal, Ankur O. ; Raj, P. Markondeya ; Sundaram, Venky ; Ravi, D. ; Koh, Sauwee ; Mullapudi, Ravi ; Tummala, Rao R.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
1139
Lastpage :
1146
Keywords :
Copper; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Fabrication; Lead; Mechanical factors; Testing; Thermomechanical processes; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441416
Filename :
1441416
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3348664
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