DocumentCode
3348664
Title
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
Author
Aggarwal, Ankur O. ; Raj, P. Markondeya ; Sundaram, Venky ; Ravi, D. ; Koh, Sauwee ; Mullapudi, Ravi ; Tummala, Rao R.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
1139
Lastpage
1146
Keywords
Copper; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Fabrication; Lead; Mechanical factors; Testing; Thermomechanical processes; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441416
Filename
1441416
Link To Document