Title :
Dielectric Integrity Test for Flip-Chip Devices with Cu/Low-k Interconnects
Author :
Odegard, Charles ; Chiu, Tz-Cheng ; Hartfield, Cheryl ; Sundararaman, Vish
fDate :
May 31 2005-June 3 2005
Keywords :
Assembly; Dielectric devices; Dielectric materials; Dielectric substrates; Packaging; Residual stresses; Semiconductor materials; Silicon; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441419
