DocumentCode :
3349057
Title :
Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints
Author :
Lau, John ; Dauksher, Walter
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
1292
Lastpage :
1298
Keywords :
Acceleration; Assembly; Capacitive sensors; Creep; Environmentally friendly manufacturing techniques; Lead; Packaging; Soldering; Stress; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441435
Filename :
1441435
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3349057
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