DocumentCode :
3349160
Title :
Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly
Author :
Bernabé, Stéphane ; Stevens, Renaud ; Volpert, Marion ; Hamelin, Régis ; Rossat, Cyrille ; Berger, Frédéric ; Lombard, Laurent ; Kopp, Christophe ; Berggren, Jesper ; Sundgren, Petrus ; Hammar, Mattias
Author_Institution :
IntexyS Photonics, Grenoble, France
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
1333
Abstract :
In order to fit with the present and future needs of the Datacom transceiver market, newly designed high rate transmitter optical subassemblies (TOSAs) have to be compact, low cost and compatible with mass production. We propose here an innovative design strategy that reaches all these targets by integrating a 10Gbps 850nm VCSEL laser diode and its laser driver with other functionalities (e.g. power monitoring and thermal monitoring) in a small form factor package. Taking advantages of the optical properties of the VCSEL and using flip-chip techniques, the transmitter exhibits excellent hyperfrequency performances and compatibility with mass production due to the use of collective manufacturing technologies and passive optical alignment. This versatile approach is also applicable to high rate receivers, parallel optics emitters, and singlemode low cost transmitter integrating long wavelength VCSELs.
Keywords :
flip-chip devices; integrated optoelectronics; optical transmitters; surface emitting lasers; 10 Gbit/s; 850 nm; VCSEL laser diode; VCSEL-based miniature optical subassembly; datacom transceiver; flip-chip technique; hyperfrequency performance; optical properties; optical receiver; parallel optics emitter; passive optical alignment; transmitter design; transmitter optical subassemblies; Costs; Integrated optics; Mass production; Monitoring; Optical design; Optical receivers; Optical transmitters; Stimulated emission; Transceivers; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441441
Filename :
1441441
Link To Document :
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