DocumentCode :
3349189
Title :
Development of Star-Shaped Four-Channel CWDM Optical-Subassembly Module
Author :
Ying-Ching Shih ; Enboa Wu
Author_Institution :
Inst. of Appl. Mech., National Taiwan Univ., Taipei
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
1343
Lastpage :
1348
Abstract :
We developed an optical sub-assembly (OSA) module for a four-channel coarse wavelength division multiplexing (CWDM) transceiver that satisfied the size requirement for XENPAK, X2 and XPAK multisource agreement (MSA). This module is composed of a frame structure with compact star-shaped optics paths, die-on-header laser or photodetector, thin film filters, ball lens and SC receptacle. The star-shaped optics design minimizes the reflective surfaces and makes the optics path shortest by using the concept of die-on-headers that are similar to To-can packages. The maximal optics path is 17.25mm from the laser diode to the fiber and the minimum is 12.00mm in the transmitter of optical subassembly (TOSA). In the receiver of optical subassembly (ROSA), the maximal optics path is 17.98mm from the fiber to photodetector and the minimum is 12.73mm. The designs of the die-on-header laser or photodetector and the frame structure provide both the passive and the active alignment versatilities. By the passive alignment method, we achieved the optimal optical condition for each channel in which the wavelengths varied from 1275nm to 1350nm. Furthermore, by using the active alignment method in the last stage of the assembly process, we compensated inaccuracies in the assembly process. As a result, the component assembly tolerance range of the OSA module increased up to 18-folds. Besides, the concept of hermetic sealing can also be executed in this design. From the analysis, it was found that the developed OSA module, no matter it is made of tool steel or optics plastic, shows good thermal stability for coupling efficiency when temperature changes from room temperature to -40degC and 85degC
Keywords :
assembling; hermetic seals; integrated optics; multichip modules; optical receivers; optical transmitters; semiconductor lasers; wavelength division multiplexing; 1275 to 1350 nm; SC receptacle; X2 multisource agreement; XENPAK multisource agreement; XPAK multisource agreement; active alignment method; assembly process; ball lens; coarse wavelength division multiplexing transceiver; die-on-header laser; hermetic sealing; laser diode; optical-subassembly module; optics paths; passive alignment method; photodetector; receiver of optical subassembly; thermal stability; thin film filters; transmitter of optical subassembly; Assembly; Fiber lasers; Optical design; Optical films; Optical filters; Optical receivers; Optical transmitters; Photodetectors; Temperature; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441443
Filename :
1441443
Link To Document :
بازگشت