DocumentCode
3349968
Title
Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)
fYear
2001
fDate
13-13 July 2001
Abstract
The following topics were dealt with: failure analysis techniques; dielectrics; packaging; metallisation; EOS; ESD; building-in reliability; hot carrier stress
Keywords
electrostatic discharge; failure analysis; hot carriers; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; EOS; ESD; building-in reliability; dielectrics; failure analysis; hot carrier stress; integrated circuits; metallisation; packaging; physical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the
Conference_Location
Singapore
Print_ISBN
0-7803-6675-1
Type
conf
DOI
10.1109/IPFA.2001.941449
Filename
941449
Link To Document