ESD effect in GMR heads in the trim shunt tab process

Author

Siritaratiwat, A. ; Suwannata, N. ; Pinnoi, J. ; Puprichitkun, C.

Author_Institution

Dept. of Electr. Eng., Khon Kaen Univ., Thailand

fYear

2001

fDate

2001

Firstpage

126

Lastpage

129

Abstract

The electrostatic discharge (ESD) effect is widely known as a main cause of damage in giant magnetoresistance (GMR) heads (Wallash and Kim, 1995). The transient current may strike the GMR head directly by passing the leads (Li-Yan Zhu, 1999) and this may be prevented by shunting the GMR leads (Bajorek et al, 1995). However, after completing the head gimbal assembly (HGA) production, the shunt leads have to be trimmed in order to test its electrical characteristics. This is thought to cause the ESD effect while trimming the shunt tab of a GMR head, and is investigated here

Keywords

electron device testing; electrostatic discharge; giant magnetoresistance; magnetic heads; magnetoresistive devices; transient analysis; ESD; ESD effect; GMR head; GMR head damage; GMR heads; GMR lead shunting; HGA production; electrical characteristics test; electrostatic discharge; giant magnetoresistance heads; head gimbal assembly production; shunt lead trimming; shunt leads; shunt tab; transient current; trim shunt tab process; Biological system modeling; Circuit testing; Electrostatic discharge; Giant magnetoresistance; Humans; Immune system; Magnetic heads; Production; Shunt (electrical); Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the

Print_ISBN

0-7803-6675-1

Type

conf

DOI

10.1109/IPFA.2001.941469

Filename

941469