New methods for scanning ultrasonic microscopy applications for failure analysis of microassembling technologies

Author

Bechou, L. ; Ousten, Y. ; Danto, Y.

Author_Institution

Lab. IXL, Bordeaux I Univ., Talence, France

fYear

2001

fDate

2001

Firstpage

195

Lastpage

201

Abstract

Scanning acoustic microscopy (SAM) is now a common detection method which produces high resolution images with focused ultrasonic waves ranging from 10 to 500 MHz. In this paper, first we propose improved methodologies in order to measure time-of-flight (TOF) with high accuracy and so localize defects in depth by digital signal processing used for the study of nonstationary signals as acoustic echoes. Secondly, we compare imaging mode capabilities associated with conventional acoustic focused probe propagation for SAM. Then, we apply these methods for localization of defects and failure analysis of ceramic capacitors, die-attach assembly and solder joint evaluation in a CBGA technology by C-SCAN analysis

Keywords

acoustic microscopy; ball grid arrays; ceramic capacitors; ceramic packaging; failure analysis; fault location; image resolution; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microassembling; soldering; 10 to 500 MHz; C-SCAN analysis; CBGA technology; SAM; acoustic echoes; acoustic focused probe propagation; ceramic capacitors; defect localization; detection method; die-attach assembly; digital signal processing; failure analysis; focused ultrasonic waves; high resolution images; imaging mode capabilities; localized defects; microassembling technologies; nonstationary signals; scanning acoustic microscopy; scanning ultrasonic microscopy applications; solder joint evaluation; time-of-flight measurement; Acoustic measurements; Acoustic signal detection; Acoustic waves; Digital signal processing; Failure analysis; Focusing; Image resolution; Microscopy; Signal resolution; Ultrasonic variables measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the

Print_ISBN

0-7803-6675-1

Type

conf

DOI

10.1109/IPFA.2001.941485

Filename

941485