DocumentCode
3350772
Title
A multi-chip module substrate testing algorithm
Author
Yao, So-Zen ; Chou, Nan-Chi ; Cheng, Chung-Kuan ; Hu, T.C.
Author_Institution
CSE Dept., California Univ., San Diego, La Jolla, CA, USA
fYear
1991
fDate
23-27 Sep 1991
Lastpage
38078
Abstract
Discusses substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The algorithm generates only about half of the test size compared to that of ordinary approaches. Multi-dimensional TSP algorithms are devised to optimize probe routes with quite encouraging results
Keywords
combinatorial mathematics; fault location; integrated circuit testing; multichip modules; production testing; MCM manufacturing; TSP algorithms; fault detection; minimum number of tests; multi-chip module substrate; open fault coverage; optimize probe routes; test size; Capacitance; Circuit faults; Circuit testing; Fault detection; Logic testing; Manufacturing; Needles; Pins; Probes; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Conference and Exhibit, 1991. Proceedings., Fourth Annual IEEE International
Conference_Location
Rochester, NY
Print_ISBN
0-7803-0101-3
Type
conf
DOI
10.1109/ASIC.1991.242925
Filename
242925
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