Pulling strength and geometry of SMT leadless chip solder joints

Author

Hui, I.K. ; Ralph, Brian

Author_Institution

Dept. of Manuf. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong

fYear

1994

fDate

5-9 Dec 1994

Firstpage

395

Lastpage

400

Abstract

A method which directly pulled the components off the printed circuit boards was used as a means for testing the bonding quality surface mount technology leadless chip solder joints. This method of testing has been applied to a number of selected chips in this study, and a was found that the ultimate tensile force which broke a component off the printed circuit board could be used as a parameter for measuring the quality of the solder joint. The failure modes of selected chips were recorded and are discussed It was found that the configuration of the metal connector of a component has significant effects on the fracture mode of the joint. The effects of solder thickness on the strength of a joint has also been investigated. In addition, a comparison on the strength of solder joints produced by adhesive wave soldering and infrared reflow methods has also been performed

Keywords

printed circuit testing; quality control; reflow soldering; surface mount technology; wave soldering; PCB testing; SMT leadless chip solder joints; adhesive wave soldering; bonding quality; infrared reflow soldering; metal connector; printed circuit boards; pulling strength; quality control; surface mount technology; Bonding; Circuit testing; Connectors; Force measurement; Geometry; Lead; Printed circuits; Semiconductor device measurement; Soldering; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Technology, 1994., Proceedings of the IEEE International Conference on

Conference_Location

Guangzhou

Print_ISBN

0-7803-1978-8

Type

conf

DOI

10.1109/ICIT.1994.467088

Filename

467088