DocumentCode :
3351963
Title :
The state-of-art and future trends in testing embedded memories
Author :
Hamdioui, Said ; Gaydadjiev, Georgi ; Van de Goor, Ad J.
Author_Institution :
Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands
fYear :
2004
fDate :
9-10 Aug. 2004
Firstpage :
54
Lastpage :
59
Abstract :
According to the International Technology Roadmap for Semiconductors (ITRS 2001), embedded memories will continue to dominate the increasing system on chips (SoCs) content in the next years, approaching 94% in about 10 years. Therefore the memory yield will have a dramatical impact on the overall defect-per-million (DPM) level, hence on the overall SoC yield. Meeting a high memory yield requires understanding memory designs, modelling their faulty behaviors in the presence of defects, designing adequate tests and diagnosis strategies as well as efficient repair schemes. This paper presents the state of art in memory testing including fault modeling, test design, built-in-self-test (BIST) and built-in-self-repair (BISR). Further research challenges and opportunities are discussed in enabling testing (embedded) memories, which use deep submicron technologies.
Keywords :
built-in self test; embedded systems; fault simulation; integrated circuit design; integrated circuit testing; integrated circuit yield; integrated memory circuits; system-on-chip; SoC yield; built-in-self-repair; built-in-self-test; deep submicron technology; defect-per-million level; embedded memory testing; fault modeling; memory designs; memory yield; system on chips; test design; Algorithm design and analysis; Art; Built-in self-test; Computer science; Costs; Embedded computing; Fault diagnosis; Logic testing; Mathematics; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Technology, Design and Testing, 2004. Records of the 2004 International Workshop on
ISSN :
1087-4852
Print_ISBN :
0-7695-2193-2
Type :
conf
DOI :
10.1109/MTDT.2004.1327984
Filename :
1327984
Link To Document :
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