• DocumentCode
    3352318
  • Title

    Research on common mode noise evaluation method

  • Author

    Zhang, Yonggao ; Gao, Yanli ; Yao, Ming ; Dong, Qiang

  • Author_Institution
    Sch. of Electr. & Electron. Eng., East China Jiaotong Univ., Nan Chang
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    1270
  • Lastpage
    1274
  • Abstract
    Common mode noise produced in single-phase full-bridge converter with bipolar SPWM is analysized. Common mode noise level evaluation method must be monodromy value and calculated simply in common mode EMI suppression system. The three evaluation indexes of maximal spectrum, average spectrum and common mode noise energy are proposed to express the common mode noise level. The computational complexity of three evaluation indexes and the relationship between three evaluation indexes and the delay time difference of two driving signals on three different conditions are studied. The computation of Common mode noise energy is very convenience without calculation of DFT or FFT. Simultaneously, the research results show that different operation conditions have no effect on the relationship between common mode noise energy and delay time difference of two driving signals. It is conclusion that common mode noise energy is a monodromy index ant can be considered as a good evaluation index of the common mode noise level.
  • Keywords
    PWM power convertors; computational complexity; electromagnetic interference; bipolar SPWM; common mode EMI suppression system; common mode noise evaluation method; computational complexity; delay time difference; single-phase full-bridge converter; Capacitors; Computational complexity; Delay effects; Electromagnetic interference; Frequency; Insulated gate bipolar transistors; Insulation; Leg; Noise level; Switches; Evaluation method; Single-phase full-bridge; average spectrum; common mode noise energy; maximal spectrum;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cybernetics and Intelligent Systems, 2008 IEEE Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-1673-8
  • Electronic_ISBN
    978-1-4244-1674-5
  • Type

    conf

  • DOI
    10.1109/ICCIS.2008.4670943
  • Filename
    4670943