DocumentCode
3352612
Title
A multi-pronged approach to defect management
Author
Paradis, D.E. ; Guldi, R.L. ; Lalena, J.N. ; Ritchison, J.W.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1995
fDate
17-19 Sep 1995
Firstpage
74
Lastpage
79
Abstract
This paper describes a comprehensive, three pronged approach to defect management combining the elements of continuous in-line monitoring, yield loss quantification, and short loop analysis. In-line monitoring provides both a historical defect baseline and a trigger for initiating corrective action in the event of out-of-control situations. Yield loss quantification involving conventional bit mapping or bin mapping partitions the yield loss by defect type and process level. Loop monitors relate trouble spots to root causes, providing a continuous measure of the progress of process and equipment improvement programs
Keywords
inspection; integrated circuit manufacture; integrated circuit yield; bin mapping; bit mapping; continuous in-line monitoring; defect management; integrated circuit manufacturing; short loop analysis; yield loss quantification; Design optimization; Inspection; Instruments; Management training; Manufacturing; Monitoring; Probes; Production; Software maintenance; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location
Austin, TX
Print_ISBN
0-7803-2928-7
Type
conf
DOI
10.1109/ISSM.1995.524363
Filename
524363
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