• DocumentCode
    3352612
  • Title

    A multi-pronged approach to defect management

  • Author

    Paradis, D.E. ; Guldi, R.L. ; Lalena, J.N. ; Ritchison, J.W.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1995
  • fDate
    17-19 Sep 1995
  • Firstpage
    74
  • Lastpage
    79
  • Abstract
    This paper describes a comprehensive, three pronged approach to defect management combining the elements of continuous in-line monitoring, yield loss quantification, and short loop analysis. In-line monitoring provides both a historical defect baseline and a trigger for initiating corrective action in the event of out-of-control situations. Yield loss quantification involving conventional bit mapping or bin mapping partitions the yield loss by defect type and process level. Loop monitors relate trouble spots to root causes, providing a continuous measure of the progress of process and equipment improvement programs
  • Keywords
    inspection; integrated circuit manufacture; integrated circuit yield; bin mapping; bit mapping; continuous in-line monitoring; defect management; integrated circuit manufacturing; short loop analysis; yield loss quantification; Design optimization; Inspection; Instruments; Management training; Manufacturing; Monitoring; Probes; Production; Software maintenance; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-2928-7
  • Type

    conf

  • DOI
    10.1109/ISSM.1995.524363
  • Filename
    524363