DocumentCode :
3352722
Title :
A review of sensing technologies for semiconductor process applications
Author :
Iturralde, Armando
Author_Institution :
Sony Semicond. Co. of America, San Antonio, TX, USA
fYear :
1995
fDate :
17-19 Sep 1995
Firstpage :
120
Lastpage :
126
Abstract :
In this paper, a review of the current literature on semiconductor process sensor technology is presented. Much of the literature discusses in-situ measurements for film thickness, particles, and/or other conditions which could affect the quality of the product. Instruments such as RGAs (Residual Gas Analyzers), in-situ particle, and in-situ film thickness monitors represent current and future advanced sensors. Prior to implementing sensors, it would be ideal to reduce the number of process measurements as much as possible to ensure sensor effectiveness. It will be ideal to have a working cost of ownership model in place to baseline operations and monitor improvements as sensors move into the production line. There are many new sensors available with highly improved performance, accuracy, and even built-in electronics. These sensors can replace or supplement existing equipment sensors to improve performance, reliability, and extend equipment life. With the increasing costs of maintaining capital equipment, successful implementation could mean substantial savings. These and many other implementation issues are also presented. The paper concludes by discussing future opportunities for new sensor technologies and emerging support technologies such as MEMS (Microelectromechanical Systems)
Keywords :
integrated circuit manufacture; integrated circuit measurement; particle size measurement; reviews; sensors; thickness measurement; cost of ownership model; film thickness monitors; implementation issues; in-situ measurements; particle monitors; process measurements; process sensor technology; residual gas analyzers; semiconductor process applications; sensing technologies; support technologies; Costs; Gas detectors; Instruments; Paper technology; Particle measurements; Production; Semiconductor films; Semiconductor process modeling; Thick film sensors; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
Type :
conf
DOI :
10.1109/ISSM.1995.524373
Filename :
524373
Link To Document :
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