Recycling of IC molding resin wastes from IC package production processes

Reported here is a study for recycling of residue of molding resin for IC packages (molding resin waste). Molding resin waste pulverized into a powder showed good surface reactivity almost comparable to that of silica powder. When the waste powder of low-stress type molding resin was recycled into standard type molding resin, the thermal resistance of the resulting product was superior to that of the standard molding resin. Moreover, the waste powder of molding resin was found to be useful as a general filler for resin type construction materials, paints and adhesives, and as a decorating agent for construction materials