Title :
Single-wafer and mini-batch wet processing for improved process performance and process characterization
Author :
Wilson, Lonnie ; Dornisch, D. ; Brown, Erik ; Ward, E.
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
The goal of this study was to determine if single-wafer/minibatch wet processing could provide improved performance and characterization over standard batch processing, and, if so, to identify the process conditions which would contribute to the throughput and overall success of this approach
Keywords :
batch processing (industrial); etching; integrated circuit yield; surface cleaning; IC industry; IC yield; etching; mini-batch wet processing; process characterization; process conditions; process performance; single-wafer wet processing; throughput; wafer cleaning; Aging; Cleaning; Corrosion; Etching; Polymers; Process control; Size control; Solvents; Testing; Throughput;
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
DOI :
10.1109/ISSM.1995.524393
