DocumentCode :
3353109
Title :
A new LSI manufacturing scheme in the large-diameter wafer era for super-quick TAT development and volume production
Author :
Koike, A. ; Shimoyashiro, S. ; Ubota, K.K. ; Suzuki, N. ; Kiguchi, Y. ; Fujisawa, A. ; Takamatsu, A. ; Okabe, T.
Author_Institution :
Semicond. & Integrated Circuits Div., Hitachi Ltd., Tokyo, Japan
fYear :
1995
fDate :
17-19 Sep 1995
Firstpage :
239
Lastpage :
242
Abstract :
We describe a new LSI manufacturing scheme which features the compatibility of quick TAT development and volume production. It is composed of a main production line and extra paths of single-wafer processing. In the super-quick TAT runs, all of the batch process steps in the main line are replaced by single-wafer processing. The process compatibility enables us to smoothly transfer from development to volume production. We discuss implementation issues, and show experimental and simulation results to verify the effectiveness of this concept in the development of logic and memory products. This approach will reduce the cost for process development, and enhance the evolution of single-wafer processing equipment towards the large-diameter wafer era
Keywords :
integrated circuit manufacture; large scale integration; LSI manufacturing; batch processing; large-diameter wafers; logic products; memory products; process development costs; single-wafer processing; super-quick TAT; turn around time; volume production; Costs; Fabrication; Integrated circuit manufacture; Investments; Large scale integration; Manufacturing processes; Production; Semiconductor device manufacture; Semiconductor devices; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
Type :
conf
DOI :
10.1109/ISSM.1995.524399
Filename :
524399
Link To Document :
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