DocumentCode :
3353134
Title :
Role of in-line defect sampling methodology in yield management
Author :
Nurani, Raman K. ; Kella, Rama ; Strojw, Andrzej J. ; Wallace, Richard
Author_Institution :
Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear :
1995
fDate :
17-19 Sep 1995
Firstpage :
243
Lastpage :
247
Abstract :
This paper presents a comprehensive methodology for yield management based on in-line defect inspection. Using the data from fabs we demonstrate algorithms for computing the sampling plan in terms of the number of lots and wafers per lot to sample at different process steps. In making those computations we take into account in-line defect based yield estimation techniques and simulation based sensitivity selection. The in-line defect data presented in this paper are obtained using KLA 21XX wafer inspection systems from fabs across the world
Keywords :
inspection; integrated circuit yield; semiconductor process modelling; KLA 21XX system; algorithms; in-line defect sampling methodology; semiconductor fabs; sensitivity; simulation; wafer inspection; yield management; Computational modeling; Inspection; Instruments; Optimized production technology; Paper technology; Process control; Sampling methods; Semiconductor device manufacture; Vehicles; Yield estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
Type :
conf
DOI :
10.1109/ISSM.1995.524400
Filename :
524400
Link To Document :
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