DocumentCode
3353203
Title
Analysis of mixed-signal manufacturability with statistical TCAD
Author
Hanson, David A. ; Goossens, Ronald J G ; Redford, Mark ; McGinty, Jim ; Kibarian, John K. ; Michaels, Kinion W.
Author_Institution
Nat. Semicond. Corp., Santa Clara, CA, USA
fYear
1995
fDate
17-19 Sep 1995
Firstpage
271
Lastpage
276
Abstract
We have developed a method which combines TCAD simulation with statistical analysis of empirical data. As a result, we can determine worst case models before a significant sample size of fabricated devices can be characterized. As measured data is collected we use models built from simulated data to analyze measured in-line and e-test data. We determine what is the minimum set of e-test or in-line measurements to control the SPICE model parameters. As a result we can provide predictive worst case models, update them based on fabrication data as development proceeds, and finally use them to control the manufacturing line
Keywords
CAD; SPICE; mixed analogue-digital integrated circuits; semiconductor process modelling; statistical analysis; IC fabrication; SPICE; TCAD simulation; e-test measurements; in-line measurements; mixed-signal manufacturability; statistical analysis; worst case model; Computer aided manufacturing; Condition monitoring; Length measurement; Manufacturing processes; Predictive models; Production; SPICE; Statistical distributions; Testing; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location
Austin, TX
Print_ISBN
0-7803-2928-7
Type
conf
DOI
10.1109/ISSM.1995.524406
Filename
524406
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