Title :
Low cost production by simplified processing
Author_Institution :
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
Abstract :
High throughput and low cost production with 100% yield is strictly demanded for ULSI manufacturing, where a decrease of minimum feature size of devices and an increase of wafer diameter is continuously enhanced for the future. It is realized by simplified processing due to a simplified device structure by introducing new concepts of devices and new materials to Si technology. Simplification of manufacturing processes becomes possible based on a full understanding of process mechanisms in a scientific manner, resulting in a dramatic reduction of process steps
Keywords :
ULSI; integrated circuit technology; surface cleaning; Si; Si technology; ULSI manufacturing; feature size; low cost production; processing; surface cleaning; throughput; wafer diameter; yield; Argon; Chemical processes; Costs; Manufacturing processes; Moisture; Production; Semiconductor device manufacture; Surface cleaning; Surface contamination; Water pollution;
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
DOI :
10.1109/ISSM.1995.524407
