DocumentCode :
3353270
Title :
Enabling recipe automation for non SECS/GEM semiconductor assembly machines.
Author :
Meng, Heong Chee ; Sani, Amin Mohd
Author_Institution :
ON Semicond., Seremban
fYear :
2007
fDate :
19-22 Nov. 2007
Firstpage :
1
Lastpage :
7
Abstract :
In today´s semiconductor manufacturing, recipe is a very important portion of the machine system. With that in mind, there is a huge demand to enable recipe automation. Recipe automation here basically covers the download and upload of a process program. The download refers to downloading from the host to the machine, while the upload is referring to transfer of process program from the machine to the host. For a non-SECS/GEM machine (i.e., one that does not support communication to the host) this will be a challenge. The main objective of performing recipe automation is to ensure that the correct recipe is being used during the bonding process. With this, we can eliminate mis-processing that is due to loading the wrong recipe.
Keywords :
assembling; computerised control; process control; semiconductor device manufacture; SECS/GEM interface; SEMI equipment communications standard/generic equipment model; equipment-to-host communications; process control; recipe automation; semiconductor assembly machines; semiconductor manufacturing; Assembly; Automatic control; Bonding processes; Costs; Humans; Manufacturing automation; Manufacturing industries; Read-write memory; Semiconductor device manufacture; Sockets;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
Type :
conf
DOI :
10.1109/EMAP.2007.4510283
Filename :
4510283
Link To Document :
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