DocumentCode :
3353476
Title :
Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials
Author :
Lee, Jung-Sub ; Vaidyanathan, Sivakumar ; Jeon, Duk Young
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon
fYear :
2007
fDate :
19-22 Nov. 2007
Firstpage :
1
Lastpage :
6
Abstract :
Fabrication of Sn-MWCNT composite layer through reflow of Sn-decorated MWCNT powder was conducted in this study. Commercially available MWCNTs were oxidized by using K2Cr2O7 / H2SO4 solution for the surface modification. The oxidized MWCNTs were dispersed in SnCL / HCl solution and subsequently a reducing agent NaBH4 was introduced to form crystalline Sn. During the Sn reduction process, 1,10-phenanthroline capping agent was introduced to control the particle shape and size. It was found that SnO2 nanoparticles on the surface of MWCNTs and crystalline Sn particles were obtained simultaneously through the chemical reduction reaction. When 1,10-phenanthroline was used, Sn particles had spherical shape and uniform size compared to the one without 1,10-phenanthroline. Afterwards, the Sn-MWCNT powders were mixed with a flux to form a paste for a wetting test on a Cu substrate. After a reflow step of the paste, Sn-MWCNT composite layer could be formed showing no separation between MWCNTs and Sn by bonding of molten Sn to SnO2 nanoparticles on the surface of MWCNTs.
Keywords :
bonding processes; carbon nanotubes; copper; interface phenomena; nanoparticles; thermal management (packaging); tin; wetting; 1,10-phenanthroline capping agent; Cu; K2Cr2O7-H2SO4; MWCNT powder; MWCNT surface modification; NaBH4; Sn-C; SnCl2-HCl; SnO2; chemical reduction reaction; copper substrates; multiwalled carbon nanotube composite layer fabrication; nanoparticles; particle shape control; phenanthroline; thermal management; tin reduction process; wetting test; Carbon nanotubes; Composite materials; Conducting materials; Crystallization; Fabrication; Nanoparticles; Organic materials; Powders; Shape control; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
Type :
conf
DOI :
10.1109/EMAP.2007.4510301
Filename :
4510301
Link To Document :
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