Effect of surface conditions on interfacial adhesion between PCB and EMC

Author

Shin, Dongkil ; Han, HyunKyung ; Lee, DongHun ; Song, Younghee ; Im, Jay

Author_Institution

Div. of Memory, Samsung Electron. Co., Hwasung

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

5

Abstract

Adhesion strength of PCB and EMC interface was investigated. Surface conditions of PCB such as the number of plasma treatment, delay time before EMC molding, and moisture soak time were considered. Adhesion strength was measured by DCB test method. Energy release rate at each crack arresting position was measured. Fracture parameters were studied by numerical simulation. Surface of PCB was analyzed by water contact angle and FT-IR.

Keywords

Fourier transforms; adhesion; cracks; epoxy insulation; moulding; plasma materials processing; printed circuit testing; surface treatment; PCB; crack arresting position measurement; double cantilever beam test method; epoxy molding compound; interfacial adhesion; moisture soak time; plasma treatment; printed circuit board; surface condition effect; Adhesives; Delay effects; Electromagnetic compatibility; Energy measurement; Moisture; Plasma measurements; Plasma simulation; Surface cracks; Surface treatment; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510308

Filename

4510308