Effect of in addition on the reaction and mechanical properties in Sn-Ag-Cu-In solder alloy

Author

Yu, A. Mi ; Lee, Chang-Woo ; Kim, Jeong-Han ; Kim, Mok-Soon ; Lee, Jong-Hyun

Author_Institution

Microjoininh Center, KITECH, Incheon

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

4

Abstract

This study investigated the reaction and mechanical properties of a In added quaternary composition solder alloy having low Ag content, i.e. Sn-xAg-0.5Cu-yIn to replace the Sn-3.0Ag-0.5Cu composition used widely as a representative Pb-free solder alloy. We found that the In addition of small amount did significantly improve a wettability of the solder at the reflow temperature of 230~240degC. Moreover, the addition did also improve outstandingly the elongation of the solder alloy, thereby increasing the toughness of the alloy. With these results, it was found that if the added amount of In and Ag are optimized, the Sn-Ag-Cu-In quaternary alloy will be a strong candidate for the replacement of Sn-3.0Ag-0.5Cu composition.

Keywords

association; copper alloys; indium alloys; melting; reflow soldering; reliability; silver alloys; solders; solidification; tin alloys; wetting; SnAgCuIn; alloy toughness; mechanical properties; quaternary composition solder alloy; reaction properties; solder alloy elongation; solder wettability; Alloying; Chip scale packaging; Force measurement; Materials science and technology; Mechanical factors; Semiconductor device modeling; Soldering; Temperature distribution; Temperature measurement; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510328

Filename

4510328