Title :
Underfill flow performance assessment
Author :
Chia, YewChoon ; Chian, K.S. ; Yi, S.
Author_Institution :
Div. of Electron. Assembly, Seagate Technol. Inc., Singapore
Abstract :
It is a common practice in the industry to use a single flip chip configuration to compare the flow performance for different underfill. However it has been a mystery whether bump configuration will affect the flow performance consistently over different types of underfill. In this paper the flow performance of 3 underfills are studied over 6 bump configurations. The result has validated the claim that a single bump configuration is sufficient in comparing the flow performance of underfills.
Keywords :
filler metals; flip-chip devices; flip chip configuration; underfill flow performance; Assembly; Electronics industry; Equations; Flip chip; Industrial electronics; Laboratories; Production engineering; Surface tension; Temperature; Viscosity;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510336
