Title :
Lumped passive circuits for 5GHz embedded test of RF SoCs
Author :
Yoon, Jangsup ; Eisenstadt, William R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Abstract :
Many companies have been trying to integrate the entire WLAN system on a SoC. Such a high level integration calls for the development of embedded self tests for the SoC. This WLAN embedded self test requires 5 GHz directional couplers, baluns, and dividers, which are presented in this work. Lumped passive 5 GHz ICs were developed to demonstrate these compact test devices. Measurement results show excellent agreement with simulation for the integrated 5 GHz coupler, balun and divider designs.
Keywords :
automatic test equipment; baluns; directional couplers; dividing circuits; embedded systems; integrated circuit testing; lumped parameter networks; passive networks; production testing; radiofrequency integrated circuits; system-on-chip; wireless LAN; 5 GHz; RF SoC; WLAN system; baluns; compact test devices; directional couplers; dividers; embedded self tests; embedded test; high level integration; lumped passive circuits; Circuit testing; Coupling circuits; Detectors; Directional couplers; Impedance matching; Microstrip; Passive circuits; RF signals; Radio frequency; System-on-a-chip;
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
DOI :
10.1109/ISCAS.2004.1328176
