DocumentCode :
3354212
Title :
In Situ Measurement of Ground Thermal Conductivity Based on Analytical Solution Models
Author :
Yang Weibo ; Zhang Hao
Author_Institution :
Sch. of Energy & Power Eng., Yangzhou Univ., Yangzhou
fYear :
2009
fDate :
27-31 March 2009
Firstpage :
1
Lastpage :
4
Abstract :
Determination of ground thermal properties is an important part of the design of ground-coupled heat pump system (GCHP). The number of boreholes and the depth and cost of each borehole are mainly dependent on the estimate of the ground thermal properties. This paper summarizes various determining method of ground thermal properties, the test apparatus, test procedure, theory basis and arithmetic on the in situ measurements of ground thermal properties based on analytical solution models are analyzed in detail, which includes the data curve-fit method based on the line heat source model and parameters estimation method based on the line heat source and cylindrical heat source model. The calculated precisions of the three methods are compared by an example calculation, the influence of test duration on calculated results is investigated. The results indicate that the estimate value of ground thermal conductivity by data-curve fit method is appreciably bigger than that by parameter estimation method and the calculated results are affected by the test duration.
Keywords :
arithmetic; heat exchangers; heat pumps; heat transfer; parameter estimation; test equipment; thermal conductivity; analytical solution models; arithmetic; boreholes; cylindrical heat source model; data-curve fit method; ground thermal conductivity; ground-coupled heat pump system; line heat source model; parameters estimation method; test apparatus; test procedure; theory basis; thermal properties; Analytical models; Conductivity measurement; Costs; Heat pumps; Parameter estimation; Power engineering and energy; Soil; Testing; Thermal conductivity; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power and Energy Engineering Conference, 2009. APPEEC 2009. Asia-Pacific
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-2486-3
Electronic_ISBN :
978-1-4244-2487-0
Type :
conf
DOI :
10.1109/APPEEC.2009.4918428
Filename :
4918428
Link To Document :
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