Title :
Performance of polymeric insulators under multistress conditions
Author :
Pollock, Terry ; Pelletier, Chad ; Chapman, Roger ; Sundararajan, Raji ; Nowlin, Robert ; Mendez, Robert ; Baker, Tony
Author_Institution :
Electron. & Comput. Eng. Technol. Dept., Arizona State Univ., Mesa, AZ, USA
Abstract :
The purpose of this paper is to report the ongoing research on multistress environmental aging of polymeric insulators at ASU East. Polymeric materials are replacing ceramic materials used for insulators on high voltage outdoor insulation. Their long term performance and reliability are a major concern for users. Manufacturers are eager to find the best material at the lowest cost while users desire long lasting, reliable insulators to reduce operating costs and increase reliability. This makes it worthwhile to investigate the performance of insulators in various environmental conditions that realistically simulate the conditions where they will be installed. Various stresses applied include UV radiation, thermal, rain, clear mist and contamination, and electrical. Presented in this paper are the results of Arizona summer and winter cycle aging performed on polymeric insulators for one year. Both lab and field aging of the insulators are being performed for different locations. Correlation between the field and lab aging will be obtained using electrical and material techniques
Keywords :
ageing; environmental degradation; polymer insulators; power distribution reliability; thermal stresses; UV radiation; clear mist; contamination; electrical stresses; high voltage outdoor insulation; long lasting reliable insulators; multistress conditions; multistress environmental aging; polymeric insulators; rain; summer and winter cycle aging; thermal stresses; Aging; Ceramics; Costs; Manufacturing; Materials reliability; Plastic insulation; Polymers; Rain; Thermal stresses; Voltage;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1999 Annual Report Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-5414-1
DOI :
10.1109/CEIDP.1999.807900