Concurrent chip-package design for 10GHz global clock distribution network

As a result of the continuous downscaling of the CMOS technology, on chip frequency for high performance microprocessor arrives 10GHz according to international technology roadmap for semiconductors (ITRS). In this paper, a 10GHz global clock distribution network using standing wave approach was analyzed on chip and package level. On chip level, a 10GHz standing wave oscillator (SWO) for global clock distribution network using 0.18μm, 1P6M CMOS technology, is designed and analyzed. The simulation results show that the skew is well controlled (about 1ps) while the clock frequency variation is about 20% because power/ground return paths exist in different metal layers. On package level, we assume that the chip size is 20mm*20mm and flip-chip bonding technology is used. The simulation results show that the skew at random positions of the transmission line (spiral or serpentine shape) is within 10% of τ_clk when the attenuation is about 1.5dB. For attenuation from 1.5dB to 6.7dB, the peak positions (n*λ/2) can be used as clock node. For the mesh and plane shape, the skew is controlled within 10% of τ_clk using standing wave method.