DocumentCode :
3355558
Title :
Incorporation of impedance boundary conditions into an advanced, integral equation, full-wave simulator
Author :
Cao, Yi ; Zhu, Zhaohui ; Wang, Xing ; Dvorak, Steven L. ; Prince, John L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
1560
Abstract :
In this paper, we incorporate the surface impedance boundary condition into a MoM-based full-wave layered interconnect simulator (UA-FWLIS) to make it capable of handling conductor losses. By introducing an effective surface current and a surface impedance, the losses on the interconnects can be easily included in UA-FWLIS by adding an extra term to the reaction elements. In addition, the losses on the power/ground planes can also be handled by modifying the Green´s function without affecting the angular integral in the reaction element calculation. Thus, the approach for analytically calculating the integrals in the reaction matrix, which uses readily computable ILHIs and residue theory, is still valid and the efficiency of UA-FWLIS can be retained. Comparing the S-parameter results from UA-FWLIS with those from agilent momentum validates the accuracy of the enhanced UA-FWLIS.
Keywords :
Green´s function methods; S-parameters; boundary integral equations; circuit simulation; conductors (electric); losses; method of moments; surface impedance; Green function; ILHI; MoM; S-parameter; UA-FWLIS; conductor loss; full-wave layered interconnect simulator; full-wave simulator; impedance boundary condition; integral equation; power/ground planes; residue theory; surface current; surface impedance; Boundary conditions; Computational modeling; Computer simulation; Conductors; Frequency; Integral equations; Packaging; Surface impedance; Testing; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441996
Filename :
1441996
Link To Document :
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