DocumentCode :
3356103
Title :
Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate
Author :
Lam, S. ; Liu, C.K. ; Mui, M.K. ; Shek, K.T. ; Kok, C.W. ; Lam, D.C.C.
Author_Institution :
Microsystems Packaging Inst., HKUST, Kowloon, China
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
1704
Abstract :
A 27-MHz wireless transmitter is fabricated with all the off-chip inductors, capacitors and resistors built on a thin organic substrate. The transmitter module occupies an area of 25 mm × 25 mm. It includes the transistor circuits on a silicon chip and off-chip passive circuits with large-value inductors and capacitors. The newly packaged transmitter module functions properly and gives a 5 dB higher output power while other performances are comparable to that of the counterpart assembled using discrete passive components. It demonstrates the possible system-on-package (SOP) solution of radio-frequency (RF) systems using the embedded passives.
Keywords :
capacitors; inductors; radio transmitters; resistors; substrates; thin film transistors; 27 MHz; capacitors; discrete passive components; embedded passives; off-chip inductors; off-chip passive circuits; radio-frequency systems; resistors; silicon chip; system-on-package; thin organic substrate; transistor circuits; transmitter module; wireless transmitter; Assembly; Capacitors; Inductors; Packaging; Passive circuits; Power generation; Radio frequency; Radio transmitters; Resistors; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1442022
Filename :
1442022
Link To Document :
بازگشت