• DocumentCode
    3356103
  • Title

    Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate

  • Author

    Lam, S. ; Liu, C.K. ; Mui, M.K. ; Shek, K.T. ; Kok, C.W. ; Lam, D.C.C.

  • Author_Institution
    Microsystems Packaging Inst., HKUST, Kowloon, China
  • fYear
    2005
  • fDate
    31 May-3 June 2005
  • Firstpage
    1704
  • Abstract
    A 27-MHz wireless transmitter is fabricated with all the off-chip inductors, capacitors and resistors built on a thin organic substrate. The transmitter module occupies an area of 25 mm × 25 mm. It includes the transistor circuits on a silicon chip and off-chip passive circuits with large-value inductors and capacitors. The newly packaged transmitter module functions properly and gives a 5 dB higher output power while other performances are comparable to that of the counterpart assembled using discrete passive components. It demonstrates the possible system-on-package (SOP) solution of radio-frequency (RF) systems using the embedded passives.
  • Keywords
    capacitors; inductors; radio transmitters; resistors; substrates; thin film transistors; 27 MHz; capacitors; discrete passive components; embedded passives; off-chip inductors; off-chip passive circuits; radio-frequency systems; resistors; silicon chip; system-on-package; thin organic substrate; transistor circuits; transmitter module; wireless transmitter; Assembly; Capacitors; Inductors; Packaging; Passive circuits; Power generation; Radio frequency; Radio transmitters; Resistors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1442022
  • Filename
    1442022