Title :
The thermal conductivity of solder joint material with plastic core
Author :
Hasegawa, Atsushi ; Okuda, Masaki ; Okinaga, Nobuyuki
Author_Institution :
Sekisui SOL Project High Performance Plastics Co., Sekisui Chem. Co., Ltd., Koga, Japan
fDate :
31 May-3 June 2005
Abstract :
We have developed a solder joint material with a plastic core. In this paper, we report on the thermal conductivity of this material. We evaluated the thermal resistance θ j-a with 352pin EBGA and 352pin PBGA, and also carried out a thermal conductivity analysis using computer simulation. The result shows that the θ j-a of the 352pin EBGA was 12°C/W, θ j-a of the 352pin PBGA was 20°C/W. So this material is applicable for high frequency and power package (CPU, MCM, MCP, stacked package and so on).
Keywords :
ball grid arrays; soldering; thermal conductivity; thermal resistance; CPU; EBGA; MCM; MCP; PBGA; high frequency package; plastic core; power package; solder joint material; stacked package; thermal conductivity; thermal resistance; Conducting materials; Conductivity measurement; Electrical resistance measurement; Electronic packaging thermal management; Joining materials; Plastics; Soldering; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1442024
