Title :
Embedded smart systems for intelligent paper and packaging
Author :
Zheng, Li-Rong ; Shen, Meigen ; Duo, Xingzhong ; Tenhunen, Hannu
Author_Institution :
R. Inst. of Technol., Stockholm, Sweden
fDate :
31 May-3 June 2005
Abstract :
In this paper, we present architecture, circuit implementation and integration issues of an embedded smart system for innovative, long-range interconnected identification/sensor network in warehouse and intelligent goods distribution systems. The network is interconnected via IEEE 802.11 and ultra-wideband (UWB) wireless air interfaces. A self-powered, ultra-low power UWB transceiver with BPSK modulation is designed for transponders and implemented in 0.18 μm CMOS technology. Low power consumption is achieved by developing innovative circuit and system architectures. Instead of pumping up energy from the Gaussian pluses emitted by the reader, a power converter draws energy from the 802.11 access point and its surrounding electromagnetic waves. Functionality of the transceiver is verified and integration issues for smart labels are investigated on thin foils of liquid crystal polymer.
Keywords :
IEEE standards; embedded systems; goods distribution; integrated circuit layout; integrated circuit packaging; low-power electronics; radiofrequency identification; sensor fusion; telecommunication standards; thin film circuits; transceivers; 0.18 micron; BPSK modulation; CMOS technology; Gaussian pluses; IEEE 802.11; access point; circuit implementation; embedded smart systems; integrated circuit; intelligent goods distribution; intelligent paper; interconnected identification/sensor network; liquid crystal polymer; low power consumption; packaging; power converter; system architecture; thin foils; ultra-low power UWB transceiver; ultra-wideband wireless air interfaces; warehouse; CMOS technology; Integrated circuit interconnections; Intelligent networks; Intelligent sensors; Intelligent systems; Packaging; Power system interconnection; Sensor systems; Transceivers; Ultra wideband technology;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1442036
