Title :
Packaging of multi-core microprocessors: tradeoffs and potential solutions
Author :
Muthana, Prathap ; Swaminathan, Madhavan ; Tummala, Rao ; Sundaram, Venkatesh ; Wan, Lixi ; Bhattacharya, S.K. ; Raj, P.M.
Author_Institution :
Sch. of Electr. & Comput. Eng. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
31 May-3 June 2005
Abstract :
Power consumption and interconnect latency are becoming major bottlenecks in the design of high performance computers and microprocessors. In this paper we propose to use a multicore processor approach to improve the performance of a processor. This paper discusses an analysis of the performance trade offs between single and multicore processors based on power, frequency, bandwidth and the role of embedded passives with high density wiring in future packages to support such processors.
Keywords :
integrated circuit packaging; microprocessor chips; interconnect latency; multicore microprocessor packaging; power consumption; Bandwidth; Delay; Energy consumption; Frequency; High performance computing; Microprocessors; Multicore processing; Packaging; Performance analysis; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1442057
