Electroless plating of Au, Pt, or Ru thin film layer on CdZnTe

The electrical and structural properties of thin metallic films (Au, Pt, or Ru) on CdZnTe (CZT) deposited by electroless deposition method have been investigated by means of Atomic Force Microscopy (AFM), Scanning Electron Microscope (SEM), Energy Dispersion X-ray (EDX), and Rutherford Backscattering Spectroscopy (RBS) measurements. SEM and AFM techniques put in evidence the modification of morphology and the change of roughness versus deposition time on the surface of contacts. The surface of Pt or Ru layer on CZT material present micro-cracks at a critical thickness, whereas it does not occur with Au layer. The thickness of Au layer with different deposition time was obtained by RBS depth profiles, which indicates a fast increase of thickness at a short deposition time and a saturation to an asymptotic value of 120 nm after 1 hour deposition.