Title :
Gold wire stress analysis of wire feed system in automatic wire bonder
Author :
Liu, Yuetao ; Liu, Yanjie ; Sun, Lining ; Li, Ji
Author_Institution :
State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
Abstract :
The wire feed system is an important subsystem of typical automatic wire bonder. The resistance control of wire transmission and tensile force control are the key technologies of the wire feed system, which has a strong impact on the bonding quality. This paper describes the stress analysis of gold wire in the automatic wire bonder. The analysis is useful in the low friction wire feed system and the low resistance transmission. Two stress models of gold wire are developed in the air guide and vacuum tensioner. The relationships between the control parameters of air guide and vacuum tensioner and the stress on gold wire are found out. Results of the experiments of this stress analysis procedure are given to illustrate the proposed models. Emphasis is placed on the construction of the mathematical models of air guide and vacuum tensioner by which the stress of gold wire is evaluated.
Keywords :
gold; lead bonding; stress analysis; air guide; automatic wire bonder; bonding quality; gold wire stress analysis; low resistance transmission; mathematical models; resistance control; stress models; tensile force control; vacuum tensioner; wire feed system; wire transmission; Automatic control; Bonding forces; Control systems; Feeds; Force control; Friction; Gold; Stress control; Tensile stress; Wire; air guide; vacuum tensioner; wire bonding wire feed system;
Conference_Titel :
Mechatronics and Automation, 2009. ICMA 2009. International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-4244-2692-8
Electronic_ISBN :
978-1-4244-2693-5
DOI :
10.1109/ICMA.2009.5245980