DocumentCode :
3359623
Title :
A high-speed, low-power 3D-SRAM architecture
Author :
Nho, H. Henry ; Horowitz, Mark ; Wong, S. Simon
Author_Institution :
Stanford Univ., Stanford, CA
fYear :
2008
fDate :
21-24 Sept. 2008
Firstpage :
201
Lastpage :
204
Abstract :
This paper presents a novel 3D-SRAM architecture that can be used to extend the scaling of SRAM. This architecture significantly reduces the bit-line capacitance, achieves 3.4 times reduction in active power consumption and 1.8 times reduction in access time. In this architecture, local bit-lines are vertical and connect through select transistors to the global bit-lines routed on the bottom level. A proof-of-concept 32Kb sub-array emulating the critical path of the 3D-SRAM has demonstrated about 5 times improvement in power-delay over conventional 2D-SRAM.
Keywords :
SRAM chips; capacitance; low-power electronics; transistor circuits; 3D-SRAM architecture; bit-line capacitance; transistors; Decoding; Degradation; Delay; Energy consumption; Integrated circuit technology; Parasitic capacitance; Power dissipation; Random access memory; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2018-6
Electronic_ISBN :
978-1-4244-2019-3
Type :
conf
DOI :
10.1109/CICC.2008.4672058
Filename :
4672058
Link To Document :
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