Title : 
A high-speed, low-power 3D-SRAM architecture
         
        
            Author : 
Nho, H. Henry ; Horowitz, Mark ; Wong, S. Simon
         
        
            Author_Institution : 
Stanford Univ., Stanford, CA
         
        
        
        
        
        
            Abstract : 
This paper presents a novel 3D-SRAM architecture that can be used to extend the scaling of SRAM. This architecture significantly reduces the bit-line capacitance, achieves 3.4 times reduction in active power consumption and 1.8 times reduction in access time. In this architecture, local bit-lines are vertical and connect through select transistors to the global bit-lines routed on the bottom level. A proof-of-concept 32Kb sub-array emulating the critical path of the 3D-SRAM has demonstrated about 5 times improvement in power-delay over conventional 2D-SRAM.
         
        
            Keywords : 
SRAM chips; capacitance; low-power electronics; transistor circuits; 3D-SRAM architecture; bit-line capacitance; transistors; Decoding; Degradation; Delay; Energy consumption; Integrated circuit technology; Parasitic capacitance; Power dissipation; Random access memory; Silicon; Wafer bonding;
         
        
        
        
            Conference_Titel : 
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
         
        
            Conference_Location : 
San Jose, CA
         
        
            Print_ISBN : 
978-1-4244-2018-6
         
        
            Electronic_ISBN : 
978-1-4244-2019-3
         
        
        
            DOI : 
10.1109/CICC.2008.4672058