DocumentCode
3359918
Title
Computational electromagnetics for multi-scale structures in circuits
Author
Chew, W.C. ; Qian, Z.G. ; Li, M.K.
Author_Institution
Univ. of Hong Kong, Hong Kong, China
fYear
2009
fDate
2-4 Dec. 2009
Firstpage
1
Lastpage
1
Abstract
This presentation summarizes some recent advances of computational electromagnetics for complex structures encountered in circuits. The results are applied for multi-scale computations encountered in computer circuits and packaging.
Keywords
computational electromagnetics; electromagnetic interference; packaging; computational electromagnetics; computer circuits; multiscale structures; packaging; Circuits; Computational electromagnetics; Computational fluid dynamics; Differential equations; Electronics packaging; Frequency; Integral equations; Matrix decomposition; Physics computing; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location
Shatin, Hong Kong
Print_ISBN
978-1-4244-5350-4
Electronic_ISBN
978-1-4244-5351-1
Type
conf
DOI
10.1109/EDAPS.2009.5403977
Filename
5403977
Link To Document