• DocumentCode
    3359945
  • Title

    High-dynamic-range zero-bias microwave detector using AlGaN/GaN-based lateral field-effect diode

  • Author

    Zhou, Qi ; Wong, King-Yuen ; Chen, Wanjun ; Chen, Kevin J.

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2009
  • fDate
    2-4 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A zero-bias microwave detector using AlGaN/GaN-based lateral field-effect diode is demonstrated. The diode is compatible with AlGaN/GaN HEMT in fabrication process. Taking advantage of threshold-voltage modulation of fluorine plasma treatment technique, the diode features low turn-on voltage and strong nonlinearity at zero bias thus eliminating DC supplies for the application of zero-bias microwave detection. The diode exhibits good sensitivity from room temperature to 250°C. The peak on-wafer measured sensitivity (ßv) of 1027 mV/mW is achieved at 5 GHz at 50°C. The maximum conjugately-matched sensitivity (ßv,opt) of 9030 mV/mW is obtained at 2 GHz at 50°C and decreases to 1227 mV/mW at 250°C. At room temperature, the dynamic range as high as 53 and 54 dB at 2 and 5 GHz is observed, respectively, which are the highest values reported so far.
  • Keywords
    III-V semiconductors; high electron mobility transistors; microwave detectors; AlGaN; DC supplies; GaN; HEMT; diode features; fabrication process; fluorine plasma treatment; frequency 2 GHz; frequency 5 GHz; high-dynamic-range zero-bias microwave detector; lateral field-effect diode; low turn-on voltage; maximum conjugately-matched sensitivity; temperature 250 degC; temperature 293 K to 298 K; temperature 50 degC; threshold-voltage modulation; zero bias; zero-bias microwave detection; Aluminum gallium nitride; Detectors; Diodes; Fabrication; Gallium nitride; HEMTs; Plasma applications; Plasma measurements; Plasma temperature; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
  • Conference_Location
    Shatin, Hong Kong
  • Print_ISBN
    978-1-4244-5350-4
  • Electronic_ISBN
    978-1-4244-5351-1
  • Type

    conf

  • DOI
    10.1109/EDAPS.2009.5403979
  • Filename
    5403979