Title :
A low-cost high-density substrate technology for wireless-related applications
Author :
Wang, Ruonan ; Lou, Robin ; Cheng, Kevin ; Yeung, Yeung ; Leung, Lydia ; Lin, Jyh-Rong ; Chung, Tom
Author_Institution :
Hong Kong Appl. Sci. & Technol. Res. Inst. (ASTRI), Shatin, China
Abstract :
A thin-film on modified ceramic (TFoMC) based substrate technology for achieving high-accuracy and high-uniformity design has been developed and implemented. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, were realized based on the proposed TFoMC technology. The IPD characterization results were close to the HFSS simulation, and demonstrated good in-substrate uniformity at the same time. The thermal shock and unbiased autoclave measurements were also carried out to evaluate the reliability of the technology. After 1000-cycle thermal shock and 96-hour autoclave storage, the IPDs exhibited no performance degradation, indicating the excellent substrate reliability and making it a promising technology for the wireless-related applications.
Keywords :
band-pass filters; ceramics; mobile radio; radio access networks; Baluns; TFoMC technology; band-pass filters; integrated passive devices; low-cost high-density substrate technology; substrate reliability; thin-film on modified ceramic; wireless-related applications; Band pass filters; Capacitors; Ceramics; Electric shock; Impedance matching; Radio frequency; Substrates; Thermal conductivity; Thin film inductors; Wireless LAN;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5403984