Title :
Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis
Author :
Takasu, Yoshiyuki ; Kikuchi, Katsuya ; Nakagawa, Hiroshi ; Koshiji, Kohji ; Aoyagi, Masahiro
Author_Institution :
NeRI, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
Abstract :
High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.
Keywords :
crosstalk; electric impedance; electromagnetic fields; printed circuits; 3D electromagnetic field analysis; 3D electromagnetic field simulation; characteristic impedance control; coaxial bend; connection structures; high-speed signal transmission; low crosstalk; printed circuit boards; rectangular coaxial line structure; simulated high-frequency characteristics; Analytical models; Circuit simulation; Coaxial components; Crosstalk; Distributed parameter circuits; Electromagnetic analysis; Electromagnetic fields; Impedance; Microstrip; Printed circuits;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5403985
